Keynote
Friday, March 27
09:00 AM - 09:30 AM
Live in Munich
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The efficiency of thermal interface materials (TIMs) is critical in electronics, e-mobility batteries, and power systems. Developing TIMs requires optimizing thermal properties, mechanical integrity, and long-term reliability. Integrating AI, simulation, circular development, and big data offers faster, sustainable development pathways. AI identifies patterns in simulation data, enhancing TIM efficiency and accelerating innovation. Simulations enable virtual modeling to optimize TIM performance before prototyping. Circular development incorporates iterative feedback loops, enabling continuous improvements in design and production processes. Big data management streamlines analysis, identifying trends to inform decisions. This talk will demonstrate how the integration of simulation, AI, circulating development, and big data management can advance the development of TIMs to improve the performance of electronic devices and systems while accelerating the development process.
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